Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel's Trojan Horse into the foundry business!
1) how broad is CPO adoption as of today? say in Amazon's or Google's datacenter; 2) curious where is Intel manufacturing this? spread around the globe or say Hillsboro ? 3) how does this work, Intel packages this for client A, switch core comes from vendor B, optics from vendor C, (I guess A maybe same as C)?; are they fully booked (capacity)?
3. Intel makes the optics. They would either fab the ASIC as well or not, but be designed into packagaing and do that. They have other packaging customers.
Cool stuff, good context for what is coming! Thanks for writing.
How is the EIC bonded to the PIC? How are the optical tiles bonded to the (organic) susbtrate?
What equipment is used for the packaging?
1) how broad is CPO adoption as of today? say in Amazon's or Google's datacenter; 2) curious where is Intel manufacturing this? spread around the globe or say Hillsboro ? 3) how does this work, Intel packages this for client A, switch core comes from vendor B, optics from vendor C, (I guess A maybe same as C)?; are they fully booked (capacity)?
1. Very little but going to ramp.
2. New Mexico fabs this
3. Intel makes the optics. They would either fab the ASIC as well or not, but be designed into packagaing and do that. They have other packaging customers.