A TSMC fab with 10 EUV machines running N3 wafers would only be capable of ~15,000 wafers per month at current power output and uptime rates. There is a major issue with EUV throughput, and Lyncean Technologies may have the solution.
Fascinating, would you agree then that each $150mn ASML machine puts out one exposure every minute per wafer at the 100W benchmark?
the article titled[Compact SR Ring of Mitsubishi Electric Corporation](in Japanese) is published at J. Particle Accelarator Society of Japan ,vol.2.No3,2005,105. Compact SR Ring of Mitsubishi Electric Corporation is introduced for X-ray lithography .